We offer a product lineup for various applications such as consumer and automotive. Solder joints of various semiconductor packages and electronic components can be reinforced.
Because the material is in liquid form and heat conductive, it shows excellent adhesion to the adherend and high heat dissipation performance.We can offer products so that they flexibly match your heat dissipation designs, such as thermal conductivity, cure conditions and viscosity.
In-vehicle displays are becoming larger, deformed and curved. In the assembly process of such displays, using adhesive between the cover glass and the resin panel instead of double-sided tape improves reliability, productivity (automation) and reduces costs.
Contact us to find out how our advanced engineering solutions can help your business