Low Outgassing Adhesive

Low outgassing adhesive ideal for vacuum applications

It generates extremely small amount of outgas under high vacuum, minimizing adverse effects on components and semiconductor elements.

• Low outgassing
  We realized ultra-low outgassing product by carefully selecting the reactive diluent, curing agent, additive and mixing ration of main agent / curing agent.
• Excellent adhesion property
  The product shows good adhesion to all adherends such as aluminum, FR-4 and steel plates.